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- ‘ëŒûŽOçO, ˜aò~, ‹g“c‘m: Ú’…ŒpŽè‚Ì‚¹‚ñ’f‹“x‚Ì‘¬“xˆË‘¶«‚Ɖž—͊ɘa‹““®, “ú–{‹@ŠBŠw‰ï˜_•¶WA•Ò, 68-665 (2002.1), pp.126-131.
- ’J–{ŒõŽj, ‰Í–ì˜a´, ‚‹´’è, ²X–Ø«Žu, ‹g“c‘m: ‹ó‹CŠªž‚Ý‚ðl—¶‚µ‚½ŠªŽæ‚èƒ[ƒ‹‚Ì“à•”‰ž—͉ðÍ, “ú–{‹@ŠBŠw‰ï˜_•¶WA•Ò, 68-665 (2002.1), pp.161-168.
- ’†“N•v, ’¹Ž”Šx, “ú–ì—²‘¾˜Y, ‹g“c‘m: 5083ƒAƒ‹ƒ~ƒjƒEƒ€‡‹à”‚̉·ŠÔFLD‚É‹y‚Ú‚·‚Ђ¸‚Ý‚¨‚æ‚тЂ¸‚Ý‘¬“xd‰»‚̉e‹¿, ‘Y«‚ƉÁH, 43-492 (2002.1), pp.66-70.
- Xin Ma, Yiyu Qian and Fusahito Yoshida: Strengthening Sn60-Pb40 solder alloy by adding trace amount of La, Materials Letters, 52 (2002.2), pp.319-322.
- Xin Ma, Yiyu Qian and F. Yoshida: Effect of La on the Cu-Sn intermetallic compound (IMC) growth and solder joint reliability, Journal of Alloys and Compounds, 334 (2002.2), pp.224-227.
- K. C. Chan, Y. Harada, J. Liang and F. Yoshida: Deformation behaviour of chromium sheets in mechanical and laser bending, Journal of Materials Processing Technology, 122 (2002.3), pp.272-277.
- ‹g“c‘m, ãX•: ‘å‚Ђ¸‚ÝŒJ•Ô‚µ‘Y«•ÏŒ`‹““®‚ð‹Lq‚·‚é\¬Ž®, “ú–{‹@ŠBŠw‰ï˜_•¶WA•Ò, 68-667 (2002.3), pp.415-421.
- ãX•, “¡Œ´Œ«Ži, ‹g“c‘m: ‚’£—Í|”Â‚Ì–Ê“à”½—Í”½“]Žž‚Ì’e‘Y«‹““®‚Æ‚»‚̃‚ƒfƒ‹‰», ‘Y«‚ƉÁH, 43-494 (2002.3), pp.224-228.
- ‹g“c‘m, –m•”³Ž÷, “ú–ì—²‘¾˜Y, Vassili V. Toropov: ’e‘Y«‹t‰ðÍ‚É‚æ‚éƒNƒ‰ƒbƒh”Â\¬‘fÞ‚ÌÞ—¿ƒpƒ‰ƒ[ƒ^“¯’è, “ú–{‹@ŠBŠw‰ï˜_•¶WA•Ò, 68-669 (2002.5), pp.766-771.
- ’†“N•v, ’¹Ž”Šx, “ú–ì—²‘¾˜Y, ‹g“c‘m: 5083ƒAƒ‹ƒ~ƒjƒEƒ€‡‹à”‚Ì[i‚è«‚É‹y‚Ú‚·‰·“x‚ƬŒ`‘¬“x‚̉e‹¿, ‘Y«‚ƉÁH, 43-497 (2002.6), pp.551-556.
- Y. Y. Qian, X. Ma and F. Yoshida: The Stress Field Characteristics in the Surface Mount Solder Joints underTemperature Cycling: Temperature Effect and Its Evaluation, Welding Journal, 81-6 (2002.6). 85S-89S.
- ãX•, ‰ª“c’B•v, ‹g“c‘m: ƒXƒvƒŠƒ“ƒOƒoƒbƒN‰ðÍ‚É‚¨‚¯‚éƒoƒEƒVƒ“ƒK[Œø‰Ê‚Ì“K؂ȃ‚ƒfƒ‹‰»‚Ìd—v«, ‘Y«‚ƉÁH, 43-498 (2002.7), pp.639-643.
- ‘ëŒûŽOçO, ‹g“c‘m: Ú’…Ú‡‚µ‚½‹à‘®”–”‚̑Y«‹È‚°‚É‹y‚Ú‚·‰ÁH‘¬“x‚̉e‹¿, “ú–{‹@ŠBŠw‰ï˜_•¶WA•Ò, 68-672 (2002.8), pp.1236-1242.
- ⌳N‘×, ‹g“c‘m, ¼‰i®“¿: Œ`ó‚Ì•¡ŽG«‚ðl—¶‚µ‚½’b‘¢»•i‚ÌŒ`󌈒è–@, “ú–{‹@ŠBŠw‰ï˜_•¶WA•Ò, 68-673 (2002.9), pp.1420-1426.
- Xin Ma, F. Yoshida and K. Shinbata: Microindentation study on the rate sensitivity of non-homogeneous solder alloy, Journal of Materials Science Letters, 21-18 (2002.9), pp.1397-1399.
- Xin Ma and Fusahito Yoshida: Interaction relation in 60Sn-Pb-0.05La ternary solder alloy, Materials Letters, 56 (2002.10), pp.441-445.
- Fusahito Yoshida, Takeshi Uemori and Kenji Fujiwara: Elastic-plastic behavior of steel sheets under in-plane cyclic tension-compression at large strain, International Journal of Plasticity, 18 (2002.10), pp.633-659.
- Fusahito Yoshida and Takeshi Uemori: A model of large-strain cyclic plasticity for sheet metals describing the Bauschinger effect and workhardening stagnation, International Journal of Plasticity, 18 (2002.10), pp.661-686.
- Toshihide Igari, Mineo Kobayashi, Fusahito Yoshida, Shoji Imatani and Tatsuo Inoue: Inelastic analysis of new thermal ratchetting due to a moving temperature front, International Journal of Plasticity, 18 (2002.9), pp.1191-1217.
- Xin Ma, Yiyu Qian and Fusahito Yoshida: Effect of lanthanum on driving force for Cu6Sn5 growth and improvement of solder joint reliability, Journal of Rare Earths, 20-2 (2002), pp.128-131.